The microvia PCB type is a flexible and inflexible PCB combination that you could be looking for. These circuits are used in military space and aerospace applications, where a very dense circuit is needed. The rigid-flexible PCB helps a substantial amount of space, resulting in electronic items that measure much less.
The term buried vertical interconnect access is those that are not visible from the exterior of the fabricated circuit board, and are formed in a sub-composite or copper-coated laminate. The vertical blind interconnects access those that are visible on the outside of the PCB, however, do not entirely pass through the board. By using the size of these small vertical interconnection ports, this interconnection density increases significantly on board. The Microvia printed circuit board uses these technologies to improve circuit density; For example, a cell phone that is using microvia technology due to the request of smaller packaging devices. Procedures used to shape microvessels include laser ablation, plasma etching, and photographic imaging.