Rigid Flex PCB Assembly

With the revolution in portable communications products over the last decade, Rigid Flex PCB Assembly have become a preferred design solution for complex, three-dimensional product assembly, and advanced component surface mounting demands.

Fully Bonded Vs Air Gap Constructions

Higher layer count Rigid Flex PCB Assembly designs may need to utilize an Un-bonded Air Gap construction, a technique which configures layers as separate pairs, as opposed to a single fully bonded unit. The thinner individual pairs provide a higher degree of flexibility.