lLines/spaces:35/40 µm
lmicro vias/pads diameter (flex):50/200 µm
lmicro vias/pad diameter (rigid, laser):75/200 µm
lThrough vias/pads diameter (rigid, mech.):125/300 µm
lThinnest dielectric thickness (flex):12 µm
lThinnest dielectric thickness (rigid):60 µm
lConductor width tolerance:+/- 20%
lArtwork to soldermask tolerance:+/- 50 µm
lLayer count up to 20
Advanced rigid-flex circuits PCB techniques
lLines/spaces:25/35 µm
lmicro vias/pads diameter (flex):40/100 µm
lmicro vias/pads diameter (rigid, laser):50/150 µm
lThinnest dielectric thickness (flex):12 µm
lThinnest dielectric thickness (rigid):46 µm
lConductor width tolerance:+/- 15%
lArtwork to soldermask tolerance:+/- 25 µm
lLayer count up to 24
Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another.
The proper application of Rigid-Flex circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components.
Additional advantages of Rigid-Flex circuit boards are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics.
Welcome you to contact our sales email by sales@hemeixinpcb.com .