Standard rigid flex pcb provides a cost effective alternative to rigid Printed Circuit Board (PCB) modules and Flexible Printed Circuit (FPC) interposers/connector systems used for low to mid-range consumer electronics products. Hemeixinpcb integrates conventional plated through-hole and microvia interconnect processing for intermediate component density designs to give you the best Standard rigid flex pcb solutions. Moreover, stiffeners, air gap construction, shielding, and coverlays from our low-cost flexible circuit systems are routinely applied as per your needs.
With prequalified materials from our matrix of low-cost, Asia-sourced rigid and flex pcb laminates and coverlays, you can expect end-to-end solutions optimized for cost-sensitive applications. Beginning with value engineering during the design and specification phase, Hemeixinpcb`s engineers work with you to create an optimal bill of materials and stack-up to deliver low cost, high processing and assembly yields, and the best field reliability.
During the rigid flex pcb design process, certain considerations must be taken into account for final product size variations. In the manufacture of rigid flex pcb boards, the flexible polyimide core will shrink once the bonded copper foil is etched away. This variation must be accounted for in the design process.